Tech Talk: With Ronald Pulvermacher

Miniaturized Electronics Sound Recording 

Miniaturized Electronics – Package on Package

Normally memory is placed beside the microprocessor, making the package large because everything is end to end. Package on package allows you to “sandwich” the microprocessor between the memory and the circuit board. Furthermore, another advantage is that there is no routing of signals. This is all done automatically and at great speeds since the memory is placed right on the microprocessor.

This process is useful for when the product has to be small such as with the healthcare industry or cell phones.  Additionally, it is useful for producing minimal Electro Magnetic Interference (EMI).  This technology could be utilized in other applications as well.  Contact Matrix Product Development for inquiries.